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FDP55N06/FDPF55N06 60V N-Channel MOSFET UniFET FDP55N06/FDPF55N06 60V N-Channel MOSFET Features * * * * * * 55A, 60V, RDS(on) = 0.022 @VGS = 10 V Low gate charge ( typical 30 nC) Low Crss ( typical 60 pF) Fast switching 100% avalanche tested Improved dv/dt capability TM Description These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies, active power factor correction, electronic lamp ballast based on half bridge topology. D G GDS TO-220 FDP Series GD S TO-220F FDPF Series S Absolute Maximum Ratings Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL TC = 25C unless otherwise noted Parameter Drain-Source Voltage - Continuous (TC = 25C) Drain Current - Continuous (TC = 100C) Drain Current - Pulsed (Note 1) FDP55N06 60 55 34.8 220 25 (Note 2) (Note 1) (Note 1) (Note 3) FDPF55N06 55 * 34.8 * 220 * 480 55 11.4 4.5 Units V A A A V mJ A mJ V/ns W W/C C C Gate-Source Voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25C) - Derate above 25C Operating and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8 from case for 5 seconds 114 0.9 -55 to +150 300 48 0.4 * Drain current limited by maximum junction temperature Thermal Characteristics Symbol RJC RJS RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Typ. Thermal Resistance, Junction-to-Ambient FDP55N06 1.1 0.5 62.5 FDPF55N06 2.58 -62.5 Units C/W C/W C/W (c)2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDP55N06/FDPF55N06 Rev. A FDP55N06/FDPF55N06 60V N-Channel MOSFET Package Marking and Ordering Information Device Marking FDP55N06 FDPF55N06 Device FDP55N06 FDPF55N06 Package TO-220 TO-220F TC = 25C unless otherwise noted Reel Size Tape Width Quantity 50 50 Electrical Characteristics Symbol Off Characteristics BVDSS BVDSS/ TJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr Notes: Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Test Conditions VGS = 0 V, ID = 250 A ID = 250 A, Referenced to 25C VDS = 60 V, VGS = 0 V VDS = 48 V, TC = 150C VGS = 20 V, VDS = 0 V VGS = -20 V, VDS = 0 V VDS = VGS, ID = 250 A VGS = 10 V, ID = 27.5 A VDS = 25 V, ID = 27.5 A VDS = 25 V, VGS = 0 V, f = 1.0 MHz (Note 4) Min 60 -----2.0 ------ Typ -0.05 -----0.018 33 1160 375 60 Max Units --1 10 100 -100 4.0 0.022 -1510 490 90 V V/C A A nA nA V S pF pF pF ns ns ns ns nC nC nC On Characteristics Dynamic Characteristics Switching Characteristics VDD = 30 V, ID = 55 A, RG = 25 ---(Note 4, 5) 30 130 70 95 30 6.5 7.5 ---40 55 65 265 150 195 37 --- ---- VDS = 48 V, ID = 55A, VGS = 10 V (Note 4, 5) -- Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0 V, IS = 55 A VGS = 0 V, IS = 55 A, dIF / dt = 100 A/s (Note 4) ------ 55 220 1.4 --- A A V ns C 1. Repetitive Rating : Pulse width limited by maximum junction temperature 2. L = 5.6mH, IAS = 55A, VDD = 50V, RG = 25 , Starting TJ = 25C 3. ISD 55A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test : Pulse width 300s, Duty cycle 2% 5. Essentially independent of operating temperature FDP55N06/FDPF55N06 Rev. A 2 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET Typical Performance Characteristics Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics VGS 10 2 ID, Drain Current [A] ID, Drain Current [A] 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V 5.5 V 5.0 V Bottom : 4.5 V Top : 10 2 150 C o 10 1 10 1 25 C o -55 C o 10 0 * Notes : 1. 250s Pulse Test o 2. TC = 25 C -1 * Notes : 1. VDS = 30V 2. 250s Pulse Test 10 10 0 10 1 10 0 2 4 6 8 10 VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 0.05 10 2 RDS(ON) [O ], Drain-Source On-Resistance 0.04 IDR, Reverse Drain Current [A] 0.03 10 1 150 C o VGS = 10V VGS = 20V 0.02 * Note : TJ = 25 C 0 25 50 75 100 125 150 175 200 o 25 C o * Notes : 1. VGS = 0V 2. 250s Pulse Test 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 ID, Drain Current [A] VSD, Source-Drain voltage [V] Figure 5. Capacitance Characteristics 2500 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd 2000 Figure 6. Gate Charge Characteristics 12 VGS, Gate-Source Voltage [V] Coss Ciss Crss = Cgd 10 Capacitances [pF] 8 VDS = 30V VDS = 48V 1500 6 1000 * Note : 1. VGS = 0 V 4 500 Crss 2. f = 1 MHz 2 * Note : ID = 55A 0 0 5 10 15 20 25 30 0 -1 10 10 0 10 1 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] FDP55N06/FDPF55N06 Rev. A 3 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature 1.2 3.0 Figure 8. On-Resistance Variation vs. Temperature BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.1 RDS(ON), (Normalized) Drain-Source On-Resistance 2.5 2.0 1.0 1.5 1.0 * Notes : 1. VGS = 10 V 2. ID = 27.5 A 0.9 * Notes : 1. VGS = 0 V 2. ID = 250 A 0.5 0.8 -100 -50 0 50 100 o 150 200 0.0 -100 -50 0 50 100 o 150 200 TJ, Junction Temperature [ C] TJ, Junction Temperature [ C] Figure 9-1. Maximum Safe Operating Area for FDP55N06 10 3 Figure 9-2. Maximum Safe Operating Area for FDPF55N06 10 3 10 s 10 2 10 s 10 2 100 s 100 s 1 ms 10 ms 100 ms Operation in This Area is Limited by R DS(on) ID, Drain Current [A] 10 1 DC Operation in This Area is Limited by R DS(on) ID, Drain Current [A] 1 ms 10 ms 10 1 DC 10 0 10 0 10 -1 * Notes : o 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse o 10 -1 * Notes : o 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse o 10 -2 10 0 10 1 10 2 10 -2 10 0 10 1 10 2 VDS, Drain-Source Voltage [V] VDS, Drain-Source Voltage [V] Figure 10. Maximum Drain Current vs. Case Temperature 60 50 ID, Drain Current [A] 40 30 20 10 0 25 50 75 100 o 125 150 TC, Case Temperature [ C] FDP55N06/FDPF55N06 Rev. A 4 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 11-1. Transient Thermal Response Curve for FDP55N06 10 0 (t), Thermal Response D=0.5 0.2 -1 10 0.1 0.05 0.02 0.01 single pulse * Notes : o 1. Z ? JC (t) = 1.1 C/W M ax. 2. Duty Factor, D=t 1/t 2 3. T JM - T C = P DM * Z ? 10 -2 JC Z? JC 10 -2 (t) 10 -5 10 -4 10 -3 10 -1 10 0 10 1 t 1 , Square W ave Pulse Duration [sec] Figure 11-2. Transient Thermal Response Curve for FDPF55N06 D =0.5 (t), Thermal Response 10 0 0.2 0.1 10 -1 0.05 0.02 0.01 * N otes : o 1. Z ? JC (t) = 2.58 C /W M ax. 2. D uty F actor, D = t 1 /t 2 Z? JC 10 -2 single pulse 3. T JM - T C = P D M * Z ? JC (t) 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q uare W ave P ulse D uration [sec] FDP55N06/FDPF55N06 Rev. A 5 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms FDP55N06/FDPF55N06 Rev. A 6 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET Peak Diode Recovery dv/dt Test Circuit & Waveforms FDP55N06/FDPF55N06 Rev. A 7 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET TO-220 9.90 0.20 1.30 0.10 2.80 0.10 (8.70) o3.60 0.10 (1.70) 4.50 0.20 1.30 -0.05 +0.10 9.20 0.20 (1.46) 13.08 0.20 (1.00) (3.00) 15.90 0.20 1.27 0.10 1.52 0.10 0.80 0.10 2.54TYP [2.54 0.20] 2.54TYP [2.54 0.20] 10.08 0.30 18.95MAX. (3.70) (45 ) 0.50 -0.05 +0.10 2.40 0.20 10.00 0.20 FDP55N06/FDPF55N06 Rev. A 8 www.fairchildsemi.com FDP55N06/FDPF55N06 60V N-Channel MOSFET Mechanical Dimensions TO-220F 3.30 0.10 10.16 0.20 (7.00) o3.18 0.10 2.54 0.20 (0.70) 6.68 0.20 15.80 0.20 (1.00x45) MAX1.47 9.75 0.30 0.80 0.10 (3 0 ) 0.35 0.10 2.54TYP [2.54 0.20] #1 2.54TYP [2.54 0.20] 4.70 0.20 0.50 -0.05 +0.10 2.76 0.20 9.40 0.20 FDP55N06/FDPF55N06 Rev. A 9 15.87 0.20 www.fairchildsemi.com TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM E2CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I16 |
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